The 15th International Semiconductor Equipment, Materials and Core Parts Expo(CSEAC CHINA 2027)

The 15th China International Semiconductor Equipment, Materials and Core Components Expo (CSEAC CHINA 2027) will be held at Suzhou International Expo Center from September 1 to 3, 2027, under the theme of "Chips Together, Global Connection".

As China’s most authoritative exhibition for semiconductor equipment and core components, CSEAC owes its professionalism, brand influence and resource‑gathering capability to the participation of numerous experts, scholars, exhibitors and attendees. Guided by the tenets of specialization, industrialization and internationalization, CSEAC builds a friendly cooperation platform for the global semiconductor community for technology exchange, business negotiation, market expansion and product promotion.

Clarification Notice

According to recent feedback and complaints from a number of CSEAC 2027exhibitors, certain organizations and individuals in the marketplace have been repeatedly contacting CSEAC exhibitors, claiming that ‘the exhibition will continue to be held in Wuxi, with only the organizer having changed’, with the intention of misleading exhibitors into a false belief that CSEAC will continue to be held in Wuxi. Such behaviour not only seriously harms the legitimate rights and interests of exhibiting companies, but also disrupts the order of the exhibition market. To safeguard the rights and interests of our partners, we hereby issue the following clarification. Please click to view the details.

Exhibition Site

Statement

Any attempt to pre-order booth space, advertise, inquire, or register as an attendee without going through the official channels designated by the CSEAC Organizing Committee,(including www.cseac.org.cn, the CEPEM official account, or calling 021-61009295/61009296) are invalid. Any disputes or financial losses arising from such activities will be borne by the individual.

CSEAC Organizing Committee
October 22, 2025

90000+ ㎡
Exhibition Area
1500+
Exhibitors
20+
Concurrent forums
150000+
Professional Visitors

Exhibition Highlights

Conference Speakers

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Otthein Herzog

Foreign Member of the Chinese Academy of Engineering, Member of the National Academy of Science and Engineering (Acatech, Germany), Professor of Tongji University
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Jie Chen

Chairman of Britech Semiconductor
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Liu Erzhuang

Shanghai Pudate Semiconductor as CEO
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Dr.Yang Xinyuan

Chairman of Xi'an ESWIN Materials
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Louise Loo

Head of Asia Economics, Oxford Economics
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Nick Yu

Founding Partner, Zhonghe Lianchuang (Dalian) Asset Management Co., Ltd.
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Tommy Sato

Deputy Secretary General of Semiconductor Equipment Association of Japan
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CJ Li

CJ Li, Executive Director of Exacta Integrated Engineering SDN BHD/ Executive Vice President of Hanglingwei (Taizhou) Technology Co., Ltd.
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Mr. Kyle R. Canavera

Partner of Ashurst Perkins Coie US LLP
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Dr. David Chen

Founder & CEO, ACCU (Yachi Group)
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Zeno Wang

Chairman ,Wellrun Microelectronics Technology Co., Ltd.
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Zhong Fenghao

Co-founder, Director and Deputy General Manager of Hangzhou Changchuan Technology Co., Ltd.
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Gao An

CEO of Shanghai MILEX Semiconductor Co ,Ltd.
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Peng Jianying

President of Nuclei System Technology Co.Ltd.
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Rebecca Xu

General Manager Greater China of Honeywell Industrial Measurement & Control
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Tadhg O'Callaghan

Director of Enterprise Ireland for Greater China
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Ma Qinghai

General Mananger, SMC Automation China Co.,Ltd.
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Roger Costa

Head of Catalonia Semiconductor Alliance
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Robin Du

China Business Representative
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Jervy Zhang

Director China of IDA Ireland
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Riccardo Budries

Marposs (Shanghai) Technologies Co., Ltd. / CEO
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Dr.Yang Xinyuan

Chairman of Xi'an ESWIN Materials
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Gary Huang

Corp VP, Head of Asia Pacific, Research and Business Development at Yole Group
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Baipeng

Chairman and President of Hua Hong Grace Semiconductor Limited
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Zhang Fan

Vice Chairman of China Electronic Production Equipment Industry Association, Director of Research Institute of Unicomp Technology (Group) Co., Ltd.
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Dong Boyu

Chairman, China Electronic Production Equipment Industry Association, CEO of NAURA Technology Group Co., Ltd.
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Wang Yanqing

Chairman, Wuxi Lead Intelligent Equipment Co., Ltd.
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Gerald Yin

Chairman & CEO, Advanced Micro-Fabrication Equipment Inc. China
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Li Jinxiang

Executive Deputy Secretary general of China Electronic Production Equipment Industry Association & Member of the Electronic Science and Technology Committee, MIIT
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Zhiyue Wang

Secretary-General, CEPEA
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Seddy Chu

Marketing VP, Jingcheng Zhongan Semiconductor Equipment (Beijing) Co., Ltd.
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Yang Yang

General Manager, Software System, Beijing Naura Microelectronics Equipment Co., Ltd.
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Gu Guodong

Deputy Director of the Administrative Committee of Wuxi High-tech Zone and Mayor of Xinwu District, Wuxi
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He Xiaolong

Chairman, China Resources Microelectronics Limited
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Zhang Wei

Chairman and General Manager, Shanghai Fudan Microelectronics Group Co., Ltd.
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Shi Dongmei

Former Chief Technology Engineer High Technology R&D Center, NSFC
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Liu Jun

Chairman, UNICOMP TECHNOLOGY GROUP CO.,LTD.
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Yu Daquan

Chairman & CEO , Xiamen Sky Semiconductor Technology Co.,Ltd.
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Linda Cai

CEO, Beijing Huafeng Test & Control Technology Co.,Ltd
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Luo Xiaojun

SVP, Dongfang Jingyuan Electron CO.,LTD.
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Chiayen Li

Head of AI R&D,Nexchip Semiconductor Corporation
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Jin Yinuo

Vice President of Process Technology,ACM Research (Shanghai), Inc.
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Mark Zheng

Co-President, Nexchip Semiconductor Corporation
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Bill Deng

Sales General Manager, Advanced Materials Technology & Engineering Co., Ltd
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Terry Chen

Deputy Director of Etching Engineering Department, Chongqing Xinlian Microelectronics Co., Ltd
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Tony Wang

Associate Director of Etch BD & Tech Marketing
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Lianjuan Ren

Senior director, Applied Materials, Inc.
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Xander Wang

Regional General Manager, Yuwei Semiconductor Technology Co.,Ltd
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Su Dong

Deputy General Manager, Jiangsu Leuven Instruments Co., Ltd
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Jack Lu

Director of Ion Implant Process Technology, Hwatsing Technology Co., Ltd.
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Zhiqiang Liu

Group Vice President, GM of CCP Etch ProductDivision, Advanced Micro Fabrication Equipment Inc. China (AMEC)
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Herman Lee

Senior Vice President, Chongqing Xinlian Microelectronics Co., Ltd.
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Hai Cong

Senior VP, Global Business Management, General Manager of Etch PBG, EPI and PECVD Division, Advanced Micro-Fabrication Equipment Inc. China (AMEC)

Forum Highlights