2024 Forum on Investment and Financing in Semiconductor Equipment and Core Components
2024 Forum on Investment and Financing in Semiconductor Equipment and Core Components
| Meeting time | Thursday, September 26 09:30-12:00 |
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| Meeting address | Hall B3, Taihu International Expo Center, Wuxi, China |
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Future of a New Equipment Manufacture Company
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Key Components: The Challenge of Domestic Substitution in Instrumentation
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One-Stop Solution for Memory Die Bonders-- From Flash to DRAM
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The breakthrough way of AMHS domestic substitution
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Roundtable dialogue
Ji ZongliangFounder Partner of Jihua Capital
Nie XiangChairman of Qingdao Sifang Sirui Intelligent Technology Co., Ltd
Neil ChenManaging Partner, SIMIC CAPITAL
Yu ChenGeneral Manager, Hua Capital Management Ltd.
Yaoliang QiGeneral Manager, Uni Semiconductor Corporation
Peng ZhangGeneral Manager, TEDA Venture Capital Corporation Limited
Special Guests of the Conference
Ji Zongliang
Founder Partner of Jihua Capital
Nie Xiang
Chairman of Qingdao Sifang Sirui Intelligent Technology Co., Ltd
Adson Su
President, Hongyang Semi-Equipment Inc.
Juby Lin
Gnenral Manager, Feejoy Technology(ShangHai)Co.,Ltd.
Yang Yang
Executive Deputy GM & CTO, Attach Point Intelligent Equipment Ltd.
Xiaoyong Gu
CEO, Linkwise Technology (Suzhou)Co., Ltd.