2024 Forum on New Devices and New Processes Driving Innovation in New Materials and New Equipment

2024 Forum on New Devices and New Processes Driving Innovation in New Materials and New Equipment

Meeting time	Thursday, September 26 13:00-18:00
Meeting address	Hall B3, Taihu International Expo Center, Wuxi, China

13:00 -13:30
Meeting Sign-in
13:30 -13:50
Leadership Speeches
13:50 -14:10
Industry-academia collaboration accelerates the innovation of IC materials

Bing Liu

SVP, Shanghai Institute of IC Materials
14:10 -14:20
The launch Event of ICMTEST
14:20 -14:40
Empower The Innovation of Power Electronics System Design by CoolSiC™ MOSFET

Lifeng Chen

Senior Director, Infineon
14:40 -15:00
A New Journey to Supporting Silicon Industry Development in Chongqing

Herman Lee

Senior VP, Business Development Center, Xinlian Microelectronics Company Limited
15:20 -15:40
The market and technology development trends of integrated circuit equipment

Ni Xiaofeng

Sr. Director, Tokyo Electron (Shanghai) Limited
15:40 -16:00
Innovation drives the development of the industry
16:00 -16:20
Light up the world with spectroscopy: Material Characterization

SHEN Jing

Department Manager, HORIBA
16:20 -16:40
Overview of Global Semiconductor Market

Lily Feng

Sr.Director, SEMI
17:00 -18:00
Upstream and downstream matchmaking

Special Guests of the Conference

Vice president, Shanghai Sinyang Semiconductor MateriaLs Co., Ltd.

SVP, Shanghai Institute of IC Materials

Senior Director, Infineon

Senior VP, Business Development Center, Xinlian Microelectronics Company Limited

Sr. Director, Tokyo Electron (Shanghai) Limited

Department Manager, HORIBA

Sr.Director, SEMI